Effect of alloying with Cu and TiN addition on the electrochemical behavior of nanocrystalline Ni processed by magnetron sputtering

Received: 12 May 2021; Revised: 04 June 2021; Accepted: 21 June 2021
Citation: M. Kumar. Effect of alloying with Cu and TiN addition on the electrochemical behavior of nanocrystalline Ni processed by magnetron sputtering. Lett. Mater., 2021, 11(3) 315-320
BibTex   https://doi.org/10.22226/2410-3535-2021-3-315-320


Graphical abstract shows the electrochemical behaviour of nanocrystalline Ni, Ni90Cu10, Ni-TiN and Ni90Cu10-TiN thin films processed by reactive magnetron co-sputteringElectrochemical behavior of the nanocomposite coatings plays an important role in order to side their applications in protective coatings either on the different tools used in automobile as well as aerospace industries or on engineering materials. For this purpose, nanocrystalline Ni, Ni90Cu10, Ni-TiN and Ni90Cu10‑TiN thin films have been deposited by reactive magnetron co-sputtering on silicon substrate. Grain sizes and the phases present in the processed films have been analyzed by using a grazing incident X-ray diffraction pattern. The average grain sizes are measured to be around 13.6 ± 0.4 nm for Ni and 9.6 ± 0.3 nm for TiN. Microstructural and elemental analyses of the investigated samples before and after the electrochemical tests have been done by field emission scanning electron microscopy and an energy dispersive X-ray analyzer, respectively. Microstructure for pure Ni films reveals the formation of pits on the surface after electrochemical test. Furthermore, the electrochemical behaviour of these thin films has been investigated with the help of potentiodynamic polarization experiments. Nanocrystalline Ni films are found to be more susceptible for pitting corrosion. Further, resistance for pitting corrosion is found to increase with alloying with Cu as well as TiN addition in Ni matrix. Formation of TiO2 protective layer has been confirmed by X-ray photo electron microscopy (XPS).

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