Microstructural characteristics of electrodeposited damascene copper lines

T.N. Konkova, S.Y. Mironov, Y. Ke, J. Onuki
Received: 26 May 2014; Revised: 22 July 2014; Accepted: 22 July 2014
Citation: T.N. Konkova, S.Y. Mironov, Y. Ke, J. Onuki. Microstructural characteristics of electrodeposited damascene copper lines. Letters on Materials, 2014, 4(2) 104-107
BibTex   DOI: 10.22226/2410-3535-2014-2-104-107

Abstract

 The high-resolution electron backscatter diffraction technique and transmission electron microscopy were applied to study micro-structure in the overburden layer, in upper and bottom parts of as-deposited as well as subsequently annealed nano-scale (100 nm width) copper wires. It was shown that the temperature interval 100oC-200oC should be seen as a transition period of microstruc-ture evolution in damascene copper lines.

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