Microstructural characteristics of electrodeposited damascene copper lines

T.N. Konkova1,2, S.Y. Mironov3, Y. Ke2*, J. Onuki2§
1Institute for Metals Superplasticity Problems RAS, Khalturin St. 39, 450001 Ufa
2Department of Materials Science and Engineering, Ibaraki University, Hitachi, Ibaraki 316-8511, Japan
3Department of Materials Processing, Graduate School of Engineering, Tohoku University, 6-6-02 Aramaki-aza-Aoba, Sendai 980-8579, Japan
Abstract
 The high-resolution electron backscatter diffraction technique and transmission electron microscopy were applied to study micro-structure in the overburden layer, in upper and bottom parts of as-deposited as well as subsequently annealed nano-scale (100 nm width) copper wires. It was shown that the temperature interval 100oC-200oC should be seen as a transition period of microstruc-ture evolution in damascene copper lines.
Received: 26 May 2014   Revised: 22 July 2014   Accepted: 22 July 2014
Views: 89   Downloads: 16
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