Effect of annealing temperature on structure of electrodeposited nano-scale copper wires

Y. Ke, T. Konkova, S. Mironov, J. Onuki
Received: 29 October 2012; Revised: 28 November 2012; Accepted: 19 December 2012
Citation: Y. Ke, T. Konkova, S. Mironov, J. Onuki. Effect of annealing temperature on structure of electrodeposited nano-scale copper wires. Letters on Materials, 2012, 2(4) 198-201
BibTex   DOI: 10.22226/2410-3535-2012-4-198-201

Abstract

High-resolution electron backscatter diffraction (EBSD) technique was employed to investigate structure evolution of electrodeposited and subsequently annealed in wide temperature interval nano-scale copper wires. The grain structure was shown to be stable in the bottom area of a trench after annealing. The wires were shown to exhibit a large fraction of low-angle boundaries as well as annealing twins.

References (9)

1.
C.M. Tan and G. Zhang. Ž in Solid Films 462-463, 263(2004).
2.
D. Kwon, H. Park and C. Lee. Ž in solid Films 475, 58(2005).
3.
J. Onuki, S. Tashiro, K. Khoo, N. Ishikawa, T. Kimura,Y. Chonan, and H. Akahoshi. Journal of theElectrochemical Society 157 (9), H857 (2010).
4.
M. Stangl, J. Acker, S. Oswald, M. Uhlemann, T.Gemming, S. Baunack, and K. Wertzig. MicroelectronicEng. 84, 54 (2007).
5.
W. Zhang, S.H. Brongersma, N. Heylen, G. Beyer, W.Vandervorst, and K. Maex. J. Electrochem. Soc. 152,C832 (2005).
6.
F.J. Humphreys. J. Microscopy 195, 170 (1999).
7.
T.B. Vaughan. Electrochimica Acta 4, 72 (1961).
8.
F.J. Humphreys, M. Hatherly. Recrystallization and relatedphenomena, Elsevier, 2004, 574 pp.
9.
Ye.V. Nesterova, V.V. Rybin. Phys. Met. Metall. 59, 169(1985).

Cited by (1)

1.
Konkova T.N., Mironov S.Yu., Ke Y., Onuki J., Письма о материалах 4(2 (14)), 104-107 (2014).