Epitaxial Tape Substrates of Perspective Ternary Alloys on Copper-Nickel Based for Superconducting Cables

Y.V. Khlebnikova, I.V. Gervas'eva, T.R. Suaridze, D.P. Rodionov, L.Y. Egorova show affiliations and emails
Received: 07 July 2016; Accepted: 12 August 2016
This paper is written in Russian
Citation: Y.V. Khlebnikova, I.V. Gervas'eva, T.R. Suaridze, D.P. Rodionov, L.Y. Egorova. Epitaxial Tape Substrates of Perspective Ternary Alloys on Copper-Nickel Based for Superconducting Cables. Lett. Mater., 2016, 6(3) 205-210
BibTex   https://doi.org/10.22226/2410-3535-2016-3-205-210

Abstract

The structure and process of the texture formation in tapes of ternary alloys Cu–Ni–Me (Me = Fe, Cr, V) in the course of cold deformation by rolling to ~99% and subsequent recrystallizing annealing has been studied. The transition metals with copper-nickel alloys form wider concentration areas than with pure copper. TEM-research of the structure of ternary alloys after texture-forming annealing didn’t detect any inclusions of any other type of crystal lattice. The sum of the components (S+C), those are propitious for the formation of cube texture in course of subsequent recrystallizing annealing, is higher than in pure copper. Optimum annealing conditions for the studied alloys have been determined, which have made it possible to produce the perfect biaxial structure, with a content of cube {001}<100>±10 grains on the surfaces of textured >99%. The possibility of achieving a perfect cube structure in thin tape made of ternary alloys on copper-nickel basis with 3d-metals (chrome, iron or vanadium) opens the prospect of using them as substrates in process of tapes of second generation high temperature superconductors manufacturing. The yield strength of the textured strips of the investigated ternary alloys is ~4 times higher than of the tape of pure copper, and ~20% higher than of the tape of the binary alloy of Cu–40% Ni. Adding of a third element to binary copper-nickel alloy, leading to additional strengthening of the tape, allows to diminish the thickness of the tape substrate and hence, the weight of the whole superconducting cable construction.

References (22)

1. H. J. Bunge. Texture Analysis in Materials Science. Mathematical Methods. London, Butterworths. (1982) 592 p.
2. Yu. V. Khlebnikova, D. P. Rodionov, I. V. Gervas’eva, T. R. Suaridze, Yu. N. Akshentsev, V. A. Kazantsev. The Physics of Metals and Metallography. 115 (12), 1231 - 1240 (2014). Crossref
3. J. L. Soubeyroux, C. E. Bruzek, A. Girard, J. L. Jorda. IEEE Trans. on applied superconductivity. 15 (2), 2687 - 2690 (2005). Crossref
4. H. Tian, H. L. Suo, O. V. Mishin, Y. B. Zhang, D. Juul Jensen, J.-C. Grivel. J Mater. Sci. 48, 4183 - 4190 (2013). Crossref
5. A. Girard, C. E. Bruzek, J. L. Jorda, L. Ortega, J. L. Soubeyrouxet. J. Phys.: Conf. Ser. 43, 341 - 343 (2006).
6. Varanasi C. V., Brunke L., J Burke, Maartense I., Padmaja N., Efstathiadis H., Chaney A. and Barnes P. N. Supercond. Sci. Technol. 19, 896 - 901 (2006). Crossref
7. Yu. V. Khlebnikova, D. P. Rodionov, I. V. Grevas’eva, T. R. Suaridze, V. A. Kazantsev. Technical Physics Letters. 41 (4), 341 - 343 (2015). Crossref
8. O. E. Osintsev, V. N. Fedorov. Spravochnik. Copper and copper alloys. М., Mashinostroenie. (2004) Р. 203 - 279. (in Russian) [О. Е. Осинцев, В. Н. Федоров. Справочник. Медь и медные сплавы: отечественные и зарубежные марки. М., Машиностроение. 2004. С. 203 - 279].
9. B. Gallistl, R. Kirchschlager, A. W. Hassel. Phys. Stat. Solidi A. 209 (5), 875 - 879 (2012). Crossref
10. C. V. Varanasi, P. N. Barnes, N. A. Yust. Supercond. Sci. Technol. 19, 85 - 95 (2006). Crossref
11. Yu. V. Khlebnikova, I. V. Gervas’eva, T. R. Suaridze, D. P. Rodionov, L. Yu. Egorova. Technical Physics Letters. 40 (10), 841 - 844 (2014). Crossref
12. Yu. V. Khlebnikova, D. P. Rodionov, I. V. Grevas’eva, L. Yu. Egorova, T. R. Suaridze. Technical Physics. 60 (3), 389 - 399 (2015). Crossref
13. Yu. V. Khlebnikova, D. P. Rodionov, L. Yu. Egorova, T. R. Suaridze. The Physics of Metals and Metallography. 117 (5), 500 - 507 (2016). Crossref
14. R. Raghavendra Bhat, P. Prasad Rao. J. of Materials Science. 29, 4808 - 4818 (1994).
15. P. Prasad Rao, B. K. Agrawal, A. M. Rao. J. of Materials Science. 21, 3759 - 3766 (1986).
16. I. V. Gervas’eva, Yu. V. Khlebnikova, D. P. Rodionov, E. S. Belosludtseva, V. A. Milyutin, T. R. Suaridze. The Physics of Metals and Metallography. 114 (2), 171 - 179 (2013). Crossref
17. I. V. Gervas’eva, B. K. Sokolov, D. P. Rodionov, Yu. V. Khlebnikova. The Physics of Metals and Metallography. 95 (1). 71 - 78 (2003).
18. I. V. Gervas’eva, B. K. Sokolov, D. P. Rodionov, Yu. V. Khlebnikova, Ya. V. Podkin. The Physics of Metals and Metallography. 96 (2), 209 - 215. (2003).
19. I. V. Grevas’eva, D. P. Rodionov, Yu. V. Khlebnikova. The Physics of Metals and Metallography. 116 (7), Р. 729 - 736 (2015). Crossref
20. I. V. Gervas’eva, D. P. Rodionov, B. K. Sokolov, Yu. V. Khlebnikova, D. V. Dolgikh. The Physics of Metals and Metallography. 90 (3), 295 - 3016. (2000).
21. R. I. Tomov, A. Kursumovic, M. Majoros. Physica C: Superconductivity and its Applications. 383, 323 - 336 (2003).
22. D. P. Rodionov, I. V. Gervas’eva, Yu. V. Khlebnikova, V. A. Kazantsev, V. A. Sazonova. The Physics of Metals and Metallography. 113 (5), 504 - 512 (2012). Crossref

Similar papers