The effect of temperature on deformation behavior and evolution of microstructure of Cu in different structure states at dynamic deformation

Д. Юечэн, И.В. Александров, В.Д. Ситдиков, Т.В. Дж show affiliations and emails
Accepted  24 April 2013
This paper is written in Russian
Citation: Д. Юечэн, И.В. Александров, В.Д. Ситдиков, Т.В. Дж. The effect of temperature on deformation behavior and evolution of microstructure of Cu in different structure states at dynamic deformation. Lett. Mater., 2013, 3(2) 79-82
BibTex   https://doi.org/10.22226/2410-3535-2013-2-79-82

Abstract

This work presents the results of the investigation of temperature effect on the dynamic behavior and microstructure evolution in an annealed coarse-grained state and in the ultrafine-grain state of Cu, obtained by the method of equal-channel angular pressing

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