The effect of temperature on deformation behavior and evolution of microstructure of Cu in different structure states at dynamic deformation

Д. Юечэн, И.В. Александров, В.Д. Ситдиков, Т.В. Дж show affiliations and emails
Accepted: 24 April 2013
This paper is written in Russian
Citation: Д. Юечэн, И.В. Александров, В.Д. Ситдиков, Т.В. Дж. The effect of temperature on deformation behavior and evolution of microstructure of Cu in different structure states at dynamic deformation. Lett. Mater., 2013, 3(2) 79-82


This work presents the results of the investigation of temperature effect on the dynamic behavior and microstructure evolution in an annealed coarse-grained state and in the ultrafine-grain state of Cu, obtained by the method of equal-channel angular pressing

References (14)

1. Meyers M.A, Mishra A., Benson D.J. Mechanical Propertiesof Nanostructured Materials. Prog. Mater. Sci., 2006, V.51, P. 427-556.
2. Christian J.W., Mahajan S. Deformation twinning, Prog.Mater. Sci., 1995, V. 39, P. 1-157.
3. Valiev R.Z., Langdon T.G. Principles of equal-channelangular pressing as a processing tool for grain refinement.Prog. Mater. Sci., 2006, V. 51, P. 881-981.
4. Valiev R.Z., Islamgaliev R.K., Alexandrov I.V. Bulknanostructured materials from severe plastic deformation.Prog. Mater. Sci., 2000, V. 45, P. 103-189.
5. Gray III G.T., Lowe T.C., Cady C.M., Valiev R.Z., Aleksandrov I.V. Influence of strain rate & temperatureon the mechanical response of ultra-fine-grained Cu, Ni, and Al-4Cu-0.5Zr, Nanostructured Mater. 1997, V. 9, P.477-480.
6. Suo T., Li Y., Xie K., Zhao F., Zhang K., Deng Q.Experimental investigation on strain rate sensitivity ofultra-fine grained copper at elevated temperatures. Mech.Mater., 2011, V. 43, P. 111-118.
7. Furukawa M., Iwahashi Y., Horita Z., Nemoto M., LangdonT.G. The shearing characteristics associated with equalchannelangular pressing. Mater. Sci. Eng., 1998, V. A.257, P. 328-332.
8. Jari Kokkonen, Veli-Tapani Kuokkala, Lech Olejnik, Andrzej Rosochowski // Proceedings of the XIthInternational Congress and Exposition. June 2-5, 2008Orlando, Florida USA.
9. Meyers M.A., Vohringer O., Lubarda V.A. The Onset ofTwinning: A Constitutive Description. Acta Mater., 2001, V. 49, P. 4025-4039.
10. Thornton P.R., Mitchell T. E. Deformation twinning inalloys at low temperatures. Phil. Mag., 1962, V. 7, P. 361-.
11. 11. Mishra A., Martin M., Thadhani N.N., Kad B.K., KenikE.A., Meyers M.A., High-strain-rate response of ultrafine-grained copper. Acta Mater., 2008, V. 56, P. 2770-2783.
12. Dong Y.C., Zhang Y., Alexandrov I.V., Wang J.T. Effect ofhigh strain rate processing on strength and ductility ofultrafine-grained Cu processed by equal channel angularpressing. Rev. Adv. Mater. Sci., 2012, V. 31, 116-122.
13. Liao X.Z., Zhao Y.H., Srinivasan S.G., Zhu Y.T., Valiev R.Z., Gunderov D.V. Deformation twinning in nanocrystallinecopper at room temperature and low strain rate. Phys.Rev. Lett., 2004, V. 84, P. 592-594.
14. Huang C.X., Wang K., Wu S.D., Zhang Z.F., Li G.Y., Li S.X.Deformation twinning in polycrystalline copper at roomtemperature and low strain rate. Acta Mater., 2006, V. 54, P. 655-665.

Cited by (1)

Roza G. Chembarisova, Igor V. Alexandrov, W. Wei. DDF. 385, 256 (2018). Crossref

Similar papers