The effect of temperature on deformation behavior and evolution of microstructure of Cu in different structure states at dynamic deformation

Dong Yuecheng, I.V. Alexandrov, V. D. Sitdikov, J. T. Wang
This work presents the results of the investigation of temperature effect on the dynamic behavior and microstructure evolution in an annealed coarse-grained state and in the ultrafine-grain state of Cu, obtained by the method of equal-channel angular pressing
Accepted: 24 April 2013
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