Влияние температуры отжига на структуру электроосажденной нанокристаллической медной проволоки

Y. Ke1, T. Konkova2,3, S. Mironov3,4*, J. Onuki2§
1Graduate School of Science and Engineering, Ibaraki University, Hitachi, Ibaraki 316-8511, Japan
2Department of Materials Science and Engineering, Ibaraki University, Hitachi, Ibaraki 316-8511, Japan
3Institute for Metals Superplasticity Problems, Russian Academy of Science, 39 Khalturin Str., Ufa, 450001, Russia
4Department of Materials Processing, Graduate School of Engineering, Tohoku University, 6-6-02 Aramaki-aza-Aoba, Sendai 980-8579, Japan
Аннотация
High-resolution electron backscatter diffraction (EBSD) technique was employed to investigate structure evolution of electrodeposited and subsequently annealed in wide temperature interval nano-scale copper wires. The grain structure was shown to be stable in the bottom area of a trench after annealing. The wires were shown to exhibit a large fraction of low-angle boundaries as well as annealing twins.
Получена: 29 октября 2012   Исправлена: 28 ноября 2012   Принята: 19 декабря 2012
Просмотры: 83   Загрузки: 8
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Цитирования
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Konkova T.N., Mironov S.Yu., Ke Y., Onuki J., Письма о материалах 4(2 (14)), 104-107 (2014).